Mill-Max Manufacturing Corp., Inc. is proud to announce the development of new spring-loaded pins delivering high current carrying capacity in a small form factor. They are ideal for charging applications as well as for directly delivering power via cable or board to board interconnects. The reduced size makes them attractive for use in low profile and dense packaging designs.

This new product offering is available in three different termination styles: surface mount, through-hole, and solder cup. All three meet two of the most demanding requirements designers currently face: the need for more power and a reduction in overall device size.